Process for producing a circuit substrate

Details Process for producing a circuit substrate Process for producing a circuit substrate

1993-07-27

1995-11-28

Engel, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156230, 156233, 264 58, 264 61, B32B 3104, B32B 3120, B32B 3126, C04B 3332

Patent

active

054704120

ABSTRACT:
A process for producing circuit substrate is prepared by preparing at least one ceramic greensheet containing glass and sinterable at a low temperature for forming the circuit substrate, and at least one unsintered transfer sheet unsinterable at a sintering temperature of the ceramic greensheet, printing a wiring pattern on the unsintered transfer sheet, stacking the unsintered transfer sheet on the ceramic greensheet to form a laminated body and thermocompressing the laminated body to form a compressed body, firing the compressed body at a sintering temperature of the ceramic greensheet to form a ceramic substrate, thereby preparing a fired body by transferring the wiring pattern on the unsintered transfer sheet to the ceramic substrate, and removing the unsintered transfer sheet from the fired body to prepare a circuit substrate.

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Patent Abstracts of Japan, vol. 13, No. 251 E-771, Dec. 6, 1989, JP-A-1051610, Feb. 27, 1989.

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