Method for applying a treatment liquid on a semiconductor wafer

Details Method for applying a treatment liquid on a semiconductor wafer Method for applying a treatment liquid on a semiconductor wafer

1989-05-26

1991-03-19

Hearn, Brian E.

Fishing, trapping, and vermin destroying

148DIG17, 134 33, H01L 2146

Patent

active

050010840

ABSTRACT:
A method of applying a treatment liquid to a semiconductor wafer to form a coating include rotating a semiconductor wafer in its own plane within a hermetically-sealed container, discharging a cleaning fluid through a cleaning fluid nozzle onto the top surface of the wafer as it rotates, and then discharging a treatment liquid through a treatment liquid nozzle onto the center of the top surface of the wafer as it rotates. An apparatus for coating a treatment liquid on a semiconductor wafer comprises a hermetically-sealed container, a wafer chuck which rotates a semiconductor wafer in its own plane, a treatment liquid nozzle for connection to a supply of treatment liquid and discharging the treatment liquid onto the center of the top surface of the wafer as it rotates, and a cleaning fluid nozzle which is disposed to discharge a pressurized cleaning fluid onto the top surface of the wafer as it rotates.

REFERENCES:
patent: 4544446 (1985-10-01), Cady
patent: 4871417 (1989-10-01), Nishizawa et al.

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