Semiconductor package and the manufacturing method

Details Semiconductor package and the manufacturing method Semiconductor package and the manufacturing method

1998-04-02

2000-08-15

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257667, 257669, 257673, H01L 2310

Patent

active

061040916

ABSTRACT:
A semiconductor package provided with a reinforcing plate on the side of the lead joined face of which a chip housing concave portion is formed, a semiconductor chip housed and fixed in the chip housing concave portion of this reinforcing plate, a plurality of leads joined and held on the lead joined face of the reinforcing plate, the inner lead section of which is joined to the semiconductor chip via a bump and in the outer lead section of which a protruded electrode is formed, a solder resist film formed on the lead except the bump formed area and the electrode formed area of this lead and a polyimide film formed on the side of the inner lead section of the lead on the solder resist film and the manufacturing method are disclosed and hereby, the quality of the semiconductor package with ultra-multipin structure is stabilized.

REFERENCES:
patent: 5409865 (1995-04-01), Karnezos
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5616958 (1997-04-01), Laine et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5668405 (1997-09-01), Yamashita
patent: 5729051 (1998-03-01), Nakamura
patent: 5751060 (1998-05-01), Laine et al.
patent: 5757078 (1998-05-01), Matsuda
patent: 5760465 (1998-06-01), Alcoe et al.

Affiliated with

Also associated with

Rating

Semiconductor package and the manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package and the manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package and the manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2009909