Microelectronic assemblies with multiple leads

Details Microelectronic assemblies with multiple leads Microelectronic assemblies with multiple leads

1998-08-24

2000-08-15

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257693, 257690, 257692, H01L 2348, H01L 2352

Patent

active

061040878

ABSTRACT:
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

REFERENCES:
patent: Re35119 (1995-12-01), Blonder et al.
patent: 3373481 (1968-03-01), Lins et al.
patent: 3795037 (1974-03-01), Luttmer
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3825353 (1974-07-01), Loro
patent: 3842189 (1974-10-01), Southgate
patent: 3952404 (1976-04-01), Matunami
patent: 4067104 (1978-01-01), Tracy
patent: 4142288 (1979-03-01), Flammer et al.
patent: 4326663 (1982-04-01), Oettal
patent: 4447857 (1984-05-01), Marks et al.
patent: 4520562 (1985-06-01), Sade et al.
patent: 4629957 (1986-12-01), Walteis et al.
patent: 4661192 (1987-04-01), McShean
patent: 4667219 (1987-05-01), Lee et al.
patent: 4721995 (1988-01-01), Tanizawa
patent: 4751199 (1988-06-01), Phy
patent: 4785137 (1988-11-01), Samuels
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4812191 (1989-03-01), Ho et al.
patent: 4893172 (1990-01-01), Matsummoto et al.
patent: 4926241 (1990-05-01), Carey
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4949158 (1990-08-01), Ueda
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5047830 (1991-09-01), Grabbe
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5055907 (1991-10-01), Jacobs
patent: 5057460 (1991-10-01), Rose
patent: 5067007 (1991-11-01), Kanji et al.
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5166099 (1992-11-01), Veda et al.
patent: 5192716 (1993-03-01), Jacobs
patent: 5197892 (1993-03-01), Yoshizawa et al.
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5230931 (1993-07-01), Yanizal et al.
patent: 5254811 (1993-10-01), Ludden et al.
patent: 5286680 (1994-02-01), Cain
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5430614 (1995-07-01), Difrancesco
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5528083 (1996-06-01), Malladi et al.
patent: 5865365 (1999-02-01), Nishikawa et al.
"Electronic Packaging and Interconnection Handbook", pp. 7.24-7.25:Harper.
"Method of Testing Chips and Joining Chips to Substrates", Research Disclosure, Feb. 1991, No. 322 Kenneth Mason Publication, Ltd., England.
IBM Technical Disclosure Bulletin, vol. 36, No. 07, Jul. 1993.

Affiliated with

Also associated with

Rating

Microelectronic assemblies with multiple leads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic assemblies with multiple leads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic assemblies with multiple leads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2009882