Thermoplastic film, reinforced hollow glass microsphere reinforc

Details Thermoplastic film, reinforced hollow glass microsphere reinforc Thermoplastic film, reinforced hollow glass microsphere reinforc

1990-12-28

1992-03-24

Lesmes, George F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

4283133, 428901, 428246, 428285, 4283139, 428416, B32B 1504, B32B 1508

Patent

active

050987810

ABSTRACT:
The present invention is directed to a metal-clad electrical laminate which comprises a core of one or more of a polyetherimide thermoplastic, polyphenylene oxide thermoplastic, or a resinous-filled reinforced substrate. A pair of intermediate layers of hollow glass microsphere-filled polyphenylene oxide/epoxy is bound to either side of the core. Finally, a pair of metal foil layers are bound to the filled intermediate layers to produce the laminate of the present invention. The laminate desirably has a thickness of less than about 0.010 in., a dielectric constant of about 3 or less, and a HGM content in excess of about 10 wt-%. Additionally, the laminate has a softening point sufficiently high to avoid substantial distortion at processing temperatures of around 200.degree.-235.degree. C.

REFERENCES:
patent: 4963425 (1990-10-01), Buchanan et al.
patent: 5049435 (1991-09-01), Uno et al.

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