Precision buttable subunits via dicing

Details Precision buttable subunits via dicing Precision buttable subunits via dicing

1989-11-22

1991-03-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156257, 1563041, 437226, B32B 3100, B29C 6500

Patent

active

050008110

ABSTRACT:
A buttable edge surface in a substrate is fabricated by sawing a back cut in a base surface of the substrate and then cutting a section cut through the upper surface of the back cut to intersect the back cut. The location of the section cut defines the buttable edge surface of the substrate. The section cut divides the substrate into a plurality of subunits which can be butted together to form an elongated array of butted subunits. The cutting blade preferably is a resinoid blade.

REFERENCES:
patent: 3706129 (1972-12-01), McCann
patent: 3859127 (1975-01-01), Lehner
patent: 3895429 (1975-07-01), Huang et al.
patent: 3913217 (1975-10-01), Misawa et al.
patent: 3972113 (1976-08-01), Nakata et al.
patent: 4237600 (1980-12-01), Rosen et al.
patent: 4237601 (1980-12-01), Woolhouse et al.
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4604161 (1986-08-01), Araghi
patent: 4612554 (1986-09-01), Poleshuk
patent: 4774530 (1988-09-01), Hawkins
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 4789425 (1988-12-01), Drake et al.
patent: 4814296 (1989-03-01), Jedlicka et al.

Affiliated with

Also associated with

Rating

Precision buttable subunits via dicing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Precision buttable subunits via dicing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Precision buttable subunits via dicing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2007963