Chemistry: electrical and wave energy – Processes and products
Patent
1981-12-23
1983-11-08
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204206, 204224R, C25D 502, C25D 508, C25D 1700
Patent
active
044140754
ABSTRACT:
An apparatus for use in selective plating a component, which apparatus comprises an electroplating zone, a series of movable selective plating heads in an endless chain configuration, wherein each plating head comprises an electrolyte opening, means for indexing the plating head to a component, means for engaging the component so as to expose an area to be selectively plated to electrolyte, means for releasably sealing the rear of the component in the region of the area to be plated, means for fastening the sealing means prior to the entry of the plating head into the electroplating zone and means for releasing the sealing means after the plating head leaves the electroplating zone, resilient or slidable couplings provided between the plating heads and means provided in the electroplating zone for supplying electrolyte to the area to be selectively plated, as well as a method of selective plating a component, which method comprises: providing an electroplating zone and moving through the electroplating zone a series of movable selective plating heads in an endless chain configuration, each plating head comprising an electrolyte opening, indexing a plating head to the component, engaging the component so as to expose an area to be selective plated, sealing the rear of the component in the region of the area to be plated, prior to the entry of the plating head into the electroplating zone, releasing the rear of the component after the plating head leaves the electroplating zone, providing resilient or slidable couplings between the plating heads and supplying, in the electroplating zone, electrolyte to the area to be selectively plated.
REFERENCES:
patent: 3974056 (1976-08-01), Jogwick
patent: 4036725 (1977-07-01), Allen
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