Method of forming a conductor pattern including fine conductor r

Details Method of forming a conductor pattern including fine conductor r Method of forming a conductor pattern including fine conductor r

1981-04-03

1983-11-08

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

29847, 228159, 228198, H05K 306

Patent

active

044137664

ABSTRACT:
Methods of forming a conductor pattern including fine conductor runs direct bonded, using a eutectic composition, to a ceramic substrate are disclosed. These methods provide grooves in the side of a metallic sheet to be bonded to the ceramic substrate, the grooves serving as vent passages for any otherwise entrapped gas between the metallic sheet and the ceramic substrate.

REFERENCES:
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3993411 (1976-11-01), Babcock et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4190474 (1980-02-01), Berdan et al.
Sun et al., Published Article in IEEE Transactions on Electron Devices, vol. ED-23, No. 8, Aug. 1976, pp. 961-967.

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