Substrate polishing apparatus and method for polishing semicondu

Details Substrate polishing apparatus and method for polishing semicondu Substrate polishing apparatus and method for polishing semicondu

1998-11-24

2000-08-15

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451285, B24B 100

Patent

active

061027804

ABSTRACT:
A substrate polishing apparatus is provided with: a turntable (36) having a polishing surface; a plate (11) having an attaching surface to which GaAs semiconductor wafers (12a through 12d) are attached; points (42a through 42d) for adjusting the gap between the GaAs semiconductor wafers (12a through 12d) attached to the plate (11) and the polishing surface of the turntable (36); and notches (16a through 16d) formed so that they extend from the portions of the plate (11), where the points (42a through 42d) are formed, to the circumference of the plate (11). A method for polishing a semiconductor substrate employs the substrate polishing apparatus.

REFERENCES:
patent: 4165584 (1979-08-01), Scherrer
patent: 5191738 (1993-03-01), Nakazato et al.
patent: 5664988 (1997-09-01), Stroupe et al.

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