Method of using a metal substrate of improved surface morphology

Details Method of using a metal substrate of improved surface morphology Method of using a metal substrate of improved surface morphology

1991-04-18

1993-11-16

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

205292, 205300, 205305, 205324, C25D 1710

Patent

active

052620409

ABSTRACT:
A metal surface is now described having enhanced adhesion of subsequently applied coatings. The substrate metal of the article, such as a valve metal as represented by titanium, is provided with a highly desirable surface characteristic for subsequent coating application. This can be initiated by selection of a metal of desirable metallurgy and heat history, including prior heat treatment to provide surface grain boundaries which may be most readily etched. In subsequent etching operation, the surface is made to exhibit well defined, three dimensional grains with deep grain boundaries. Subsequently applied coatings, by penetrating into the etched intergranular valleys, are desirably locked onto the metal substrate surface and provide enhanced lifetime even in rugged commercial environments.

REFERENCES:
patent: 3948736 (1976-04-01), Russell
patent: 4572770 (1986-02-01), Beaver et al.
Hayfield, Titanium as a Substrate for Electrodes; Birmingham, Eng. pp. 1-11, FIGS. 1-13.

Affiliated with

Also associated with

Rating

Method of using a metal substrate of improved surface morphology does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of using a metal substrate of improved surface morphology, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of using a metal substrate of improved surface morphology will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-20010