Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1973-03-15
1976-04-27
Van Horn, Charles E.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29578, 29625, 156 13, 156 18, 204 32R, 204 38B, 204192, 427 89, 427 91, 427401, H05K 306, H05K 316
Patent
active
039532666
ABSTRACT:
A method of fabricating a semiconductor composite comprises providing a semiconductor substrate having a platinum layer, masking the platinum layer with a chromium mask layer, applying a patterned photoresist layer over the chromium mask layer, etching away portions of the chromium mask layer in accordance with the pattern of the photoresist layer to accordingly pattern the chromium mask layer, then etching away portions of the platinum layer in accordance with the etched chromium layer, and finally removing the remaining portions of the chromium mask layer. The chromium layer is interposed between the platinum and photoresist layers due to its excellent adhesive compatibility with both the platinum and the photoresist layers and the presence of the chromium layer effectively prevents the etching solution for the platinum from penetrating between the platinum and photoresist layers.
REFERENCES:
patent: 2566615 (1951-09-01), Keilholtz et al.
patent: 3193418 (1965-07-01), Coorer et al.
patent: 3256588 (1966-06-01), Sikina et al.
patent: 3507756 (1970-04-01), Wenger
patent: 3657029 (1972-04-01), Fuller
Thomas et al., Electronics, Jan. 24, 1966, pp. 77-81.
Adams Bruce L.
Burns Robert E.
Lobato Emmanuel J.
Massie Jerome W.
Van Horn Charles E.
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