Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component
Patent
1985-06-03
1986-09-16
Lesmes, George F.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Composite having voids in a component
427 541, 427177, 427180, 427208, 427215, 427217, 4283175, 4283179, 428325, 428333, 428336, 428406, 428428, 428432, 428698, 428906, B32B 300
Patent
active
046122427
ABSTRACT:
The invention primarily concerns a pressure-sensitive adhesive tape, the adhesive layer of which is filled with glass microbubbles and has a dark appearance by virtue of the microbubbles having a thin-film coating having an average thickness from 0.05 to 30 nm. A preferred thin-film coating is silver which can be applied by sputtering or by vapor deposition, preferably to an average thickness of between 1 and 10 nm.
REFERENCES:
patent: Re24906 (1960-12-01), Ulrich
patent: 3365315 (1968-01-01), Beck et al.
patent: 3826226 (1974-07-01), Clark
patent: 4223067 (1980-09-01), Levens
patent: 4239384 (1982-05-01), Vesley et al.
patent: 4288337 (1981-09-01), Ota et al.
patent: 4303485 (1981-12-01), Levens
patent: 4330590 (1982-05-01), Vesley
patent: 4340642 (1982-07-01), Netting et al.
patent: 4353951 (1982-10-01), Yukitoshi et al.
patent: 4391646 (1983-07-01), Howell
patent: 4415615 (1983-11-01), Esmay et al.
Chamberlain Craig S.
McAllister Jerome W.
Vesley George F.
Zimmerman Patrick G.
Brink Richard E.
Lesmes George F.
Minnesota Mining and Manufacturing Company
Schwartz P. R.
Sell Donald M.
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