Semiconductor substrate provided with marks for alignment even u

Details Semiconductor substrate provided with marks for alignment even u Semiconductor substrate provided with marks for alignment even u

1989-08-28

1991-01-01

Hearn, Brian E.

Metal treatment

Barrier layer stock material, p-n type

437226, 437228, 437229, 437231, 437924, 148DIG102, 156657, H01L 2147

Patent

active

049815296

ABSTRACT:
A semiconductor substrate is provided with alignment marks for recognizing and deciding positions of registration of a wafer and a mask in a photolithographic step that is included in a process of manufacturing a semiconductor device. The alignment marks, X alignment marks and Y alignment marks in a preferred embodiment are arranged only on straight lines which are parallel to corresponding X and Y axes of a Cartesian Coordinate system for registration of the substrate the alignment marks which extend to avoid obstructions, such as steps defined along dicing lines that prevent flow of resist to be coated onto the semiconductor substrate.

REFERENCES:
patent: 3928094 (1975-12-01), Angell

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