Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1995-08-04
1996-12-17
Carroll, J.
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257635, 257659, 437922, H01L 2900
Patent
active
055856632
ABSTRACT:
An electrically programmable fuse buried under quartz and layers of polyimide with a specific structure to enhance its "thermal" capabilities. The fuse is designed to "blow" and cool off quickly so as not to cause damage to areas above and surrounding the fuse. A passivation layer is added above the fuse to act as a heat sink and absorb and redistribute the heat generated from one localized area to a broader and cooler area. The materials used for the fuse and the heat sink are selected to be compatible with both oxide and polyimide personalization schemes. Modeling of the fuse enables optimizing the characteristics of the fuse, particularly to transmit to the surface of the passivation layer the thermal wave created during programming of the fuse.
REFERENCES:
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patent: 4617723 (1986-10-01), Mukai
patent: 4796075 (1989-01-01), Whitten
patent: 4862243 (1989-08-01), Welch et al.
patent: 5256899 (1993-10-01), Rangappan
patent: 5350710 (1994-09-01), Hong et al.
"Process and Structure for Laser Fuse Blowing", IBM Technical Disclosure Bulletin, vol. 31, No. 12 (May 1989) p. 93.
Bezama Raschid J.
Schepis Dominic J.
Seshan Krishna
Carroll J.
International Business Machines - Corporation
Schnurmann H. Daniel
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