Method for production of printed circuits by electroless metal p

Details Method for production of printed circuits by electroless metal p Method for production of printed circuits by electroless metal p

1978-03-08

1979-04-24

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

106 733, 156656, 156659, 427 97, 427259, 427306, 427307, 427336, C23C 302, H01B 514

Patent

active

041513134

ABSTRACT:
Printed circuits are produced on an insulating substrate by electroless metal plating according to a method comprising steps of:

REFERENCES:
patent: 3443988 (1969-05-01), McCormack
patent: 3562038 (1971-02-01), Shipley
patent: 3672925 (1972-06-01), Feldstein
patent: 3993799 (1976-11-01), Feldstein
Feldstein, "Selective Electroless Plating Techniques, A Survey," Plating, 8, 1970.
Specification for Electroless Copper Film for Additive Printed Wiring Application (Institute of Printed Circuits, Additive Circuitry Committee, USA, Fall Meeting, 1972).

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