Method of testing a semiconductor device by automatically measur

Details Method of testing a semiconductor device by automatically measur Method of testing a semiconductor device by automatically measur

1997-04-21

2000-10-03

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3102

Patent

active

061278319

ABSTRACT:
An integrated probe tip (20) parameter measuring device (70) is integrated onto the chuck (24) or substrate holder of a probe test station (10). Probe tip (20) force can be simultaneously measured for either a single probe tip, several probe, or all of the probe tips on a probe card (18). Integrating the measurement of probe tip (20) parameters such as probe tip force into a test station (10) yields real-time data about the probe process and allows feedback between measured probe tip parameters and probe chuck overdrive in the vertical direction. This integrated testing is done by periodically testing probe tip (20) parameters during the probing of die (26) on a wafer (22).

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