Apparatus for forming a metal thin film utilizing temperature co

Coating apparatus – Gas or vapor deposition – With treating means

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118724, C23C 1600, C23C 1646, C23C 1652

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049811037

ABSTRACT:
In an apparatus for forming an aluminum thin film, or an aluminum alloy thin film useful to an interconnecting material of an electronic device, there are provided: a processing chamber capable of keeping a vacuum condition therein; a substrate holder mounted within said processing chamber, for holding a substrate and performing a temperature adjustment; a first temperature adjusting mechanism for performing the temperature adjustment of said substrate via said substrate holder whereby a part of element consisting said predetermined gas is deposited on the surface of said substrate; a gas conducting mechanism for conducting a predetermined gas into said processing chamber; an exhausting mechanism for exhausting an interior of said processing chamber; a distributing plate provided within said processing chamber, for uniformly supplying said predetermined gas to a surface of said substrate; and a second temperature adjusting mechanism for adjusting the temperature of said distributing plate.

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