Integrated circuit probe testing device and method

Details Integrated circuit probe testing device and method Integrated circuit probe testing device and method

1995-09-21

1997-08-26

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

371 2231, 364483, G01R 3128

Patent

active

056614071

ABSTRACT:
The invention provides efficient probe testing of integrated circuits. Bonding pads of the integrated circuits are provided with logic state components and data recording components. Logic circuits of the above components are serially connected to form shift registers. The shift registers permit input and output of data by an integrated circuit test device through a small number of test pads. The number of test pads remain the same for different types of integrated circuits. A single set of test pads may be used to probe test all the integrated circuits of a single semiconductor wafer.

REFERENCES:
patent: 5424589 (1995-06-01), Dobbelaere et al.

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