Method of forming p-type silicon carbide

Chemistry of inorganic compounds – Silicon or compound thereof – Binary compound

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423345, 437100, C01B 3136

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active

053667131

ABSTRACT:
A method of forming p-type silicon carbide which comprises using reactive source gases comprising silane, hydrogen, trimethylboron, and either diborane or boron trifluoride, to thereby attain a widened band gap by the action of the carbon contained in the trimethylboron.

REFERENCES:
patent: 3382113 (1968-05-01), Ebert et al.
patent: 4133689 (1979-01-01), Stroke
patent: 4755483 (1988-07-01), Haku et al.
patent: 4775425 (1988-10-01), Guha et al.
patent: 4847215 (1989-07-01), Hanaki et al.
patent: 4891330 (1990-01-01), Guha et al.
patent: 5021103 (1991-06-01), Hamakawa et al.
patent: 5061322 (1991-10-01), Asano
patent: 5206180 (1993-04-01), Yoshida
Technical Digest of International PVSEC-3, Nov. 1987.
Patent Abstracts of Japan, vol. 7, No. 205 (C-185)(1350) 9 Sep. 1983 & JP-A-58-104013.
Chemical Abstracts, vol. 99, No. 16, 1983, Columbus, Ohio, US; abstract no. 132341r, `Amorphous silicon carbide film doped with boron for electronic devices`.
Patent Abstracts of Japan, vol. 16, No. 322 (E-1233) 14 Jul. 1992 & JP-A-40-94172.

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