Process and apparatus for manufacturing ceramic semiconductor pa

Details Process and apparatus for manufacturing ceramic semiconductor pa Process and apparatus for manufacturing ceramic semiconductor pa

1996-06-24

1997-08-26

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437214, 437219, 437220, H01L 2160

Patent

active

056610904

ABSTRACT:
Ceramic semiconductor packages which comprise a lead frame (1) having registering holes (4, 5) and a ceramic substrate (2) having a thermally fusible bonding material such as a resin or glass applied to the sealing surface (6) of the substrate are manufactured by positioning the lead frame, using a transfer device (14), on a lead frame-supporting plate (11) having holes (20, 21), through which positioning pins (22) formed on a positioning base (12) are made to protrude by lifting the base (12) by a driving mechanism (13), in such a manner that the positioning pins pass through the registering holes (4, 5) of the lead frame. The substrate is then centered and positioned on the lead frame using a transfer device (15) having chuck hands (33). Thereafter, the bonding material is fused by heating in a heating furnace (16) to bond the lead frame and the substrate.

REFERENCES:
patent: 5019209 (1991-05-01), Hiraide et al.
patent: 5200368 (1993-04-01), Kojima et al.
patent: 5264002 (1993-11-01), Egashira et al.
patent: 5352633 (1994-10-01), Abbott
patent: 5372972 (1994-12-01), Hayashi et al.
patent: 5410804 (1995-05-01), Berendts
patent: 5537737 (1996-07-01), Kamakura et al.
patent: 5548890 (1996-08-01), Tada et al.
patent: 5569625 (1996-10-01), Yoneda et al.

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