Method of bonding an aluminum wire to an intergrated circuit bon

Details Method of bonding an aluminum wire to an intergrated circuit bon Method of bonding an aluminum wire to an intergrated circuit bon

1994-09-30

1997-08-26

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438654, 438655, 438612, H01L 21283, H01L 21603

Patent

active

056610815

ABSTRACT:
A process for manufacturing bonding pad adapted for use with an aluminum wire that resists stresses that would otherwise peel the pad from the substrate. The pad has a polysilicon layer adhered to an insulating layer on a semiconductor substrate, a overlying refractory metal polycide layer, a second polysilicon layer, a refractory metal layer, and a thick aluminum alloy bonding pad.

REFERENCES:
patent: 4278989 (1981-07-01), Baba et al.
patent: 4364166 (1982-12-01), Crowder et al.
patent: 4398335 (1983-08-01), Lehrer
patent: 4600658 (1986-07-01), Anderson et al.
patent: 4800177 (1989-01-01), Nakamae
patent: 4916397 (1990-04-01), Masuda et al.
patent: 4948747 (1990-08-01), Pfiester
patent: 4984056 (1991-01-01), Fujimoto et al.
patent: 5036383 (1991-07-01), Mori
patent: 5057447 (1991-10-01), Paterson
patent: 5102827 (1992-04-01), Chen et al.
patent: 5373192 (1994-12-01), Eguchi
patent: 5432129 (1995-07-01), Hodges

Affiliated with

Also associated with

Rating

Method of bonding an aluminum wire to an intergrated circuit bon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding an aluminum wire to an intergrated circuit bon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding an aluminum wire to an intergrated circuit bon will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1988085