Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Patent
1995-11-13
1997-08-26
Tsai, Jey
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
438397, H01L 218242
Patent
active
056610645
ABSTRACT:
A capacitor construction includes, a) first and second electrically conductive capacitor plates separated by an intervening capacitor dielectric layer, the first capacitor plate comprising first and second container members, the second container member being received inside of the first container member, the first and second container members comprising a respective ring portion and a respective base portion; and b) a pedestal disk positioned elevationally intermediate the first container member base and the second container member base to space and support the second container member relative to the first container member. The structure is preferably produced by using a series of alternating first and second layers of semiconductive material provided over a molding layer within a container contact opening therein. One of the first and second layers has an average conductivity enhancing dopant concentration of greater than about 5.times.10.sup.19 ions/cm.sup.3, with the other of the first and second layers having an average conductivity enhancing dopant concentration from 0 ions/cm.sup.3 to about 5.times.10.sup.19 ions/cm.sup.3. At least one of the first and second layers is selectively etchable relative to the other of the first and second layers to facilitate a container construction and formation of the pedestal disk. Utilization of alternate materials to the doped semiconductive material is also contemplated.
REFERENCES:
patent: 4558509 (1985-12-01), Tiwari
patent: 4568565 (1986-02-01), Gupta et al.
patent: 5023683 (1991-06-01), Yamada
patent: 5053351 (1991-10-01), Fazan et al.
patent: 5130172 (1992-07-01), Hicks et al.
patent: 5139825 (1992-08-01), Gordon et al.
patent: 5168073 (1992-12-01), Gonzalez et al.
patent: 5216267 (1993-06-01), Jin et al.
patent: 5300321 (1994-04-01), Nakano et al.
patent: 5320878 (1994-06-01), Maya
patent: 5403620 (1995-04-01), Kaesz et al.
Conrad J.R. et al., "Ion Bea, Assisted Coating And Surface Modification With Plasma Source Ion Implantation", J. Vac. Sci. Technol., A 8 (4), Jul./Aug. 1990, 3146-3151.
T.Morihara et al., "Disk-Shaped Stacked Capacitor Cell for 256 Mb Dynamic Random-Access Memory", Aug. 19, 1994, Jpn. J. Appl. Phys. vol. 33 (1994), Pt. 1, No. 8, pp. 14-19.
S.Woo et al., "Selective Etching Technology of in-situ P Doped Poly-Si (SEDOP) for High Density DRAM Capacitors", 1994 Symposium on VLSI Technology Digest of Technical Papers, pp. 25-26.
H. Watanabe et al., "Stacked Capacitor Cells for High-density dynamic RAMs", IEDM 1988, pp. 600-603.
Fazan Pierre C.
Figura Thomas
Micro)n Technology, Inc.
Tsai Jey
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