Method of polishing semiconductor wafers and apparatus therefor

Details Method of polishing semiconductor wafers and apparatus therefor Method of polishing semiconductor wafers and apparatus therefor

1994-08-03

1996-12-17

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451288, 451289, 451388, 451398, B24B 100, B24B 2900

Patent

active

055847463

ABSTRACT:
A method of polishing semiconductor wafers and apparatus therefore are described. According to the present invention, a semiconductor wafer mounted on the lower side of a wafer mounting plate may be polished on a polishing pad by the front referenced polishing technique due to a flexibility of the wafer mounting plate to make the same to conform in detail with the backside contour of the wafer under polishing pressure and a selected flexibility differential between a wafer holding region and the outer moving region of the wafer mounting plate. An apparatus includes the wafer mounting plate that also works as a vacuum chuck plate is constructed out of a flexible thin disc of hard plastics, a central round region is used for a wafer holding region facing the backside of the wafer and the outside annular region is more flexible to work as a moving region, a pan-shaped rubber sheet is secured to a ring projection, the wafer mounting disc is adhered to the inner periphery of the rubber sheet at and along the periphery thereof to generate a sealed space, passes for vacuum communication and for a compressed air supply are formed through a rotary shaft, and vacuum chuck holes are communicated with the vacuum pass and the compressed air pass is in communication with a sealed space in the wafer holder.

REFERENCES:
patent: 4508161 (1985-04-01), Holden
patent: 4671145 (1987-06-01), Fehrenbach et al.
patent: 4918869 (1990-04-01), Kitta
patent: 5029418 (1991-07-01), Bull
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5423558 (1995-06-01), Koeth et al.
patent: 5441444 (1995-08-01), Nakajima

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