Method of fabricating integrated circuits including photo optica

Details Method of fabricating integrated circuits including photo optica Method of fabricating integrated circuits including photo optica

1990-01-12

1991-08-06

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 66, 437226, 437 3, 437905, H01L 3118, H01L 2178

Patent

active

050377655

ABSTRACT:
Integrated circuits are formed by bonding two substrates together on a moat or recess. If the moat is exposed at a side wall, an optical fiber is inserted therein and communicates optically with a photoelectric device in the substrate by a slant side wall of the moat. If the moat is sealed by a cover layer resulting from removing all or most of the top substrate leaving the bonding layer as a cover, a pressure responsive device is formed on the cover layer directly or in the remaining top substrate over the sealed cavity.

REFERENCES:
patent: 3864019 (1975-02-01), Smolinsky et al.
patent: 3997381 (1976-12-01), Wanlass
patent: 4121334 (1978-10-01), Wallis
patent: 4210923 (1980-07-01), North et al.
patent: 4294510 (1981-10-01), Chappell
patent: 4756590 (1988-07-01), Forrest et al.
patent: 4760569 (1988-07-01), Mahlein
patent: 4857746 (1989-08-01), Kuhlmann et al.
patent: 4897711 (1990-01-01), Blonder et al.
Dielectric Isolation of Silicon by Anodic Bonding; Anthony; J. Appl. Phys; vol. 58, No. 3; 8/85, pp. 1240-1247.
Silicon and Silicon Dioxide Thermal Bonding, Black et al., GE R&D, vol. 107, pp. 495-498, 1988.
Silicon and Silicon Dioxide Thermal Bonding for SOI Applications, Black et al., Dec. 87, pp. 2773-2777, vol. 63.
Dielectric Isolation of Silicon by Anodic Bonding, Anthony, J. Appl. Phys, vol. 58, No. 3, Aug. 85, pp. 1240-1247.
Wafer Bonding for Silicon on Insulator Technologies, J. B. Lasky, Appl. Phys. Lett., vol. 48, No. 1, Jan. 86, pp. 78-80.

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