Process for electroforming copper foil

Details Process for electroforming copper foil Process for electroforming copper foil

1978-01-16

1979-09-25

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

204 28, 204 33, 204 52R, C25D 104

Patent

active

041690184

ABSTRACT:
An improved copper electroplating method typically for use on a carrier material such as aluminum is provided by pretreating of the carrier surface and electrodepositing copper foil utilizing a single-step copper plating process comprising an acidic plating bath containing copper, nitrate, and fluoride ions which can be operated at a single-current density.

REFERENCES:
patent: 2871172 (1959-01-01), Atkinson
patent: 2882209 (1959-04-01), Brown
patent: 3634205 (1972-01-01), Melillo
patent: 3969199 (1976-07-01), Berdan
patent: 3990926 (1976-11-01), Konicek
patent: 3998601 (1976-12-01), Yates

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