Process for thermal gradient zone melting utilizing a beveled wa

Details Process for thermal gradient zone melting utilizing a beveled wa Process for thermal gradient zone melting utilizing a beveled wa

1978-12-07

1979-09-25

Ozaki, G.

Metal treatment

Compositions

Heat treating

148177, 148187, 252 623E, H01L 21225

Patent

active

041689925

ABSTRACT:
A wafer of semiconductor material processed by thermal gradient zone melting is supported by a beveled inner peripheral surface defining an aperture in a guard ring to minimize the distortion of the thermal gradient at the outer peripheral edge surface of the wafer.

REFERENCES:
patent: 2813048 (1957-11-01), Pfann
patent: 3179860 (1965-04-01), Clark et al.
patent: 3895967 (1975-07-01), Anthony et al.
patent: 4001047 (1977-01-01), Boah
patent: 4035199 (1977-07-01), Anthony et al.
patent: 4075038 (1978-02-01), Anthony et al.

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