Device with bonded conductive and insulating substrates and meth

Measuring and testing – Fluid pressure gauge – Diaphragm

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Details

29 2541, 73718, 3612834, G01L 912

Patent

active

053657900

ABSTRACT:
A device with bonded and conductive substrates is disclosed. This device includes a conductive substrate (509) having an electrically insulating layer (515) disposed on a portion thereon. An electrically conductive layer (519) is disposed on the electrically insulating layer (515). Then an insulating substrate (101) having a first surface (103) and an opposing second surface (105) with an electrically conductive coating (516) disposed on a portion thereon is provided. Finally, the insulating substrate (101) is bonded to the electrically conductive layer (519). In a more specific embodiment a capacitive pressure sensor is disclosed. This capacitive pressure sensor has a sealed chamber (125) and is further constructed with a conductive substrate (509) having an electrically insulating layer (515) disposed thereon. Further, an electrically conductive layer (519) is located on the electrically insulating layer (515) and an insulating substrate (101) having an electrically conductive coating (516) disposed thereon is bonded to the electrically conductive layer (519). Conductive feedthrough passageways (107, 109) are provided so that a measurement circuit may be electrically connected to the capacitive pressure sensor. Additionally a method for fabricating such devices is disclosed.

REFERENCES:
patent: 3634727 (1972-01-01), Polye
patent: 3858097 (1974-12-01), Polye
patent: 4025942 (1977-05-01), Kurtz
patent: 4261086 (1981-04-01), Giachino et al.
patent: 4384899 (1983-05-01), Myers
patent: 4415948 (1983-11-01), Grantham et al.
patent: 4432007 (1984-02-01), Cady
patent: 4586109 (1986-04-01), Peters et al.
patent: 4625561 (1986-12-01), Mikkor
patent: 4701424 (1987-10-01), Mikkor
patent: 4773972 (1988-09-01), Mikkor
patent: 4831492 (1989-05-01), Kuisma
patent: 4833039 (1989-05-01), Mitoff et al.
patent: 4838088 (1989-06-01), Murakami
patent: 4875134 (1989-10-01), Kuisma
"VLSI Technology", edited by S. M. Sze, published by McGraw-Hill Book Company in 1983, pp. 92-95, 150-151.

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