Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-05-14
1994-11-22
Hall, Carl E.
Metal working
Method of mechanical manufacture
Electrical device making
29841, 156285, 156382, 1565833, H05K 330
Patent
active
053656563
ABSTRACT:
A process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated, onto a printed wiring board (PWB), which exhibit significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages and padded semiconductor chips during cure of conductive adhesives (AdCons), and leads to the reduction of variations in initial interconnection resistance, and thereby to the enhancement of the reliability of AdCon interconnections. The pressures are applied to the devices by an external application of a fluid under pressure to a flexible, resiliently stretchable membrane which conformably envelops outlines of the devices and adjacent areas of the PWB. Application of vacuum suction to within the cavity, formed by the pressure frame and the membrane, prior to the external application of the fluid pressure to the membrane, further improving the reliability of surface mounted assembly of packages on the interconnection board. The external application of pressure enhances thermal conductivity needed for curing the AdCon, increases the range of processing parameters usable for this technique and reduces assembly times. Assembly yields approaching 100% were observed for a variety of surface mounted packages indicating that the system will be highly reliable.
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patent: 4667401 (1987-05-01), Clements et al.
patent: 4868637 (1989-09-01), Clements et al.
patent: 5108532 (1992-04-01), Thein et al.
B. Sun, "`The Paste Connector`-Vertically Conductive Adhesive", Connection Technology, pp. 31-32 (1988).
Dahringer Donald W.
Lyons Alan M.
Alber Oleg E.
AT&T Corp.
Hall Carl E.
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