Method of fabricating compliant interface for semiconductor chip

Details Method of fabricating compliant interface for semiconductor chip Method of fabricating compliant interface for semiconductor chip

1994-12-29

1997-08-26

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 156330, 257668, 257778, 438780, H05K 334

Patent

active

056599528

ABSTRACT:
A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

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