Hermetically packaged HDI electronic system

Details Hermetically packaged HDI electronic system Hermetically packaged HDI electronic system

1993-06-07

1994-05-24

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174253, 174255, 174260, 174261, 174 524, 257676, 257688, 257700, 257723, 257724, 257684, 361760, 361761, 361762, 361772, 361774, 361792, 361793, 361794, 361807, 361809, 361813, H01L 23053, H01L 23055, H01L 2310, H05K 116

Patent

active

053154860

ABSTRACT:
A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner contact points and a set of outer contact points bridging a seal ring that comprises either a solder seal or a weldable seal for the hermetic package lid. The outer contact points may be directly connected to a leadframe. The leadframe leads, after severing, can be directly attached to a printed circuit board.

REFERENCES:
patent: 3614832 (1971-10-01), Chance et al.
patent: 4630096 (1986-12-01), Drye et al.
patent: 4633573 (1987-01-01), Scherer
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 4814943 (1989-03-01), Okuaki
patent: 4835847 (1989-06-01), Kamperman
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patent: 4870224 (1989-09-01), Smith et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 5049978 (1991-09-01), Bates et al.
patent: 5138436 (1992-08-01), Koepf
IBM Disclosure Bulletin "Low-Temperature Alloy Seal For Electronic Modules" by D. G. Pittwood vol. 19 No. 8 Jan. 1977.

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