Semiconductor integrated circuit including opposed substrates of

Details Semiconductor integrated circuit including opposed substrates of Semiconductor integrated circuit including opposed substrates of

1995-08-09

1997-02-25

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Charge transfer device

257777, 257 67, 257200, 257146, 257278, 257508, 257565, H01L 2978, H01L 2706, H01L 2708, H01L 2700

Patent

active

056061862

ABSTRACT:
An insulating film having a through hole aligned with an electrode on a first semiconductor element is formed on a first semiconductor substrate and a metal is disposed in the through hole. A second semiconductor element on a second semiconductor substrate is placed on the insulating film in such a way that an electrode of the second semiconductor element contacts the metal. Thus, a plurality of transistors having different performance characteristics and functions can be easily disposed adjacent to each other for improved integration.

REFERENCES:
patent: 4122479 (1978-10-01), Sugawara et al.
patent: 4614960 (1986-09-01), Bluzer
patent: 4889824 (1989-12-01), Selle et al.
patent: 5041884 (1991-08-01), Kumamoto et al.
patent: 5168338 (1992-12-01), Kumada et al.
patent: 5521401 (1996-05-01), Zamanian et al.

Affiliated with

Also associated with

Rating

Semiconductor integrated circuit including opposed substrates of does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor integrated circuit including opposed substrates of, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit including opposed substrates of will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1975959