Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1995-05-01
1996-11-26
Karlsen, Ernest F.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324755, 324760, G01R 3102
Patent
active
055789340
ABSTRACT:
A method and apparatus for testing unpackaged semiconductor dice includes a mother board and a plurality of interconnects mounted on the mother board and adapted to establish a temporary electrical connection with the dice. The interconnects can be formed with a silicon substrate and raised contact members for contacting the bond pads of a die. Alternately the interconnects can be formed with micro bump contact members mounted on an insulating film. The mother board allows each die to be tested separately for speed and functionality and to also be burn-in tested in parallel using standard burn-in ovens. In an alternate embodiment testing is performed using a mother board/daughter board arrangement. Each daughter board includes interconnects that allow the dice to be tested individually for speed and functionality. Multipule daughter boards can then be mounted to the mother board for burn-in testing using standard burn-in ovens.
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Akram Salman
Farnworth Warren M.
Hembree David R.
Wood Alan G.
Gratton Stephen A.
Karlsen Ernest F.
Micro)n Technology, Inc.
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