Method for checking a connection of wires and control apparatus

Image analysis – Applications – Manufacturing or product inspection

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382150, 382164, G06T 760

Patent

active

057579555

ABSTRACT:
A color image pickup 33 picks up a color image of cores 9 soldered to the inner wall of a metal tube 12 of a connector 11 by a solder 16b. A component image of the color of the cores 9 is extracted from the color image. A non-soldered area of the cores 9 exposed from the solder 16b is calculated based on the extracted component image. The calculated non-soldered area is compared with a first threshold value to determine whether or not the cores 9 are satisfactorily soldered (i.e., the wires are satisfactorily connected). Connection of the wires can be checked with a uniform quality and an improved accuracy.

REFERENCES:
patent: 4271330 (1981-06-01), Watine et al.
patent: 4283596 (1981-08-01), Vidakovits et al.
patent: 4547897 (1985-10-01), Peterson
patent: 4832248 (1989-05-01), Soni et al.
patent: 5157463 (1992-10-01), Brown et al.
patent: 5483603 (1996-01-01), Luke et al.
patent: 5562243 (1996-10-01), Marcantonio
Shigeki Kobayashi et al., Identifying Solder Surface Orientation from Color Highlight Images, Omron Institute of Life Science, Apr. 1990, pp. 821-825.

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