Semi-additive circuitry with raised features using formed mandre

Details Semi-additive circuitry with raised features using formed mandre Semi-additive circuitry with raised features using formed mandre

1991-08-30

1993-05-04

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Electrical product

C25D 120

Patent

active

052078876

ABSTRACT:
A circuit is produced by using a formed mandrel (10,12) and semi-additive techniques for creating circuit traces. A stainless steel mandrel (10) flash plated with copper (14) includes a depression (12) which will form a raised interconnection feature (24). Using a photolithographically formed pattern of photoresistive material (16) on the mandrel the selected pattern of circuit traces (18,20) and raised features (24) are electroplated onto the flash plated mandrel. After stripping the photoresist (16), a dielectric substrate (26) is laminated to the circuit traces, effectively encapsulating the traces on three sides. After removing the laminated circuit traces and dielectric from the mandrel the flash plated copper (14) is removed and the circuit covered with an insulation coverlay.

REFERENCES:
patent: 3181986 (1965-05-01), Pritikin
patent: 4125441 (1978-11-01), Dugan

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