Method for forming a multi chip module (MCM)

Details Method for forming a multi chip module (MCM) Method for forming a multi chip module (MCM)

1995-05-01

1996-11-26

Picardat, Kevin

Fishing, trapping, and vermin destroying

437 8, 437183, 437215, H01L 2160

Patent

active

055785263

ABSTRACT:
A method for forming a multi chip module for singulated semiconductor dice or dice contained on a wafer is provided. The method includes forming an interconnect adapted to support and establish an electrical connection with the dice. The interconnect includes a substrate formed of a material such as silicon with raised contact members. The raised contact members include projections adapted to penetrate contact locations on the dice (e.g., bond pads) to a limited penetration depth to establish the electrical connection. A conductive layer and conductive traces are formed on the substrate to form an electrical path to the contact members. Programmable links, such as fuses or anti-fuses, can be included in the electrical path for enabling or disabling select dice of the module. A packaged multi chip module assembly can be formed by encapsulation of the dice and substrate in an insulating material or by forming a ceramic base and cover.

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