Semiconductor device and a fabrication process thereof

Fishing – trapping – and vermin destroying

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437209, 437211, 437214, 437217, 437219, 437220, H01L 2160

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active

055785255

ABSTRACT:
A semiconductor device includes a package substrate and a semiconductor chip provided on the package substrate, wherein there is provided a jumper substrate carrying thereon electrodes and conductor patterns that connect the electrodes, such that the jumper substrate is mounted upon the package substrate for providing an interconnection between the electrode patterns provided on the upper major surface of the package substrate in electrical connection with the electrode pads on the semiconductor chip and the electrodes that are isolated in correspondence to the through-holes provided on the package substrate.

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