Die attachment method for use in high density interconnected ass

Details Die attachment method for use in high density interconnected ass Die attachment method for use in high density interconnected ass

1991-03-19

1992-09-29

Wojciechowicz, Edward J.

357 55, 357 68, 357 69, 357 80, H01L 2302

Patent

active

051517760

ABSTRACT:
A method for grounding or electrically biasing an integrated circuit chip without using a conductive die attach material comprises affixing the chips to a substrate using a thermoplastic polyimide adhesive. A metallization layer electrically connects the sides of the chips, which act as grounding surfaces, to a biased or grounded conductive layer on the substrate. The top surfaces of the integrated circuit chips which include the interconnection pads are protected against undesired metallization by a removable protective layer while the metallization layer is applied. Metal electroplated on the metallization layer serves the functions of a heat sink for the chip and a ground plane between chips.

REFERENCES:
patent: 4698662 (1987-10-01), Young et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4937660 (1990-06-01), Dietrich et al.

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