Semiconductor integrated circuit device

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Details

357 59, H01L 2348, H01L 2946, H01L 2954, H01L 2904

Patent

active

051517728

ABSTRACT:
A semiconductor integrated circuit device is provided which includes a memory cell array located in a generally central area of a semiconductor substrate with peripheral circuits located at both ends of the semiconductor substrate. A wiring layer is also provided which couples the peripheral circuits to one another. This wiring layer is arranged to have a double-layer structure of first and second aluminum layers which are electrically coupled to one another.

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Glasser et al., "The Design Analysis of VLSI Circuits" 1985 pp. 267-268.

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