Shielded semiconductor device

Details Shielded semiconductor device Shielded semiconductor device

1990-11-21

1992-09-29

Carroll, J.

357 71, 357 84, H01L 2940, H01L 2348, H01L 2946, H01L 2504

Patent

active

051517701

ABSTRACT:
A semiconductor device operable in the microwave frequency range and including a shielding means isolating one integrated circuit (or group of integrated circuits) on the substrate from others. The shielding means is formed by integrated circuit manufacturing techniques, and avoids the necessity for assembling separate integrated circuit chips on a metallic shielding member. An insulator film is formed on the substrate overlying the integrated circuits. Conductive shielding means are embedded in the insulating film to define a line separating the integrated circuits to be shielded. The shielding means has a spacing density and height above the substrate adapted to block electromagnetic radiation between the integrated circuits. An effective ground is applied to the shielding means so that it performs its isolation function.

REFERENCES:
patent: 3754170 (1973-08-01), Tsuda et al.
patent: 4477736 (1984-10-01), Onishi
patent: 4494217 (1985-01-01), Suzuki et al.
patent: 4599680 (1986-07-01), Gibson et al.
patent: 4729063 (1988-03-01), Matsuo et al.
patent: 4958222 (1990-09-01), Takakura et al.
D. R. Tomsa et al., "Multilayer laminated chip carrier", IBM Technical Disclosure Bulletin, vol. 21 (Sep. 1978) pp. 1396-1397.

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