Method of making a registration mark on a semiconductor

Fishing – trapping – and vermin destroying

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437 90, 437228, 437924, 437944, 437966, 148DIG50, 148DIG51, 148DIG106, 257797, H01L 2120

Patent

active

053148371

ABSTRACT:
The process of making a registration mark on an integrated-circuit substrate wherein photoimaging first is used to define an optically-recognizable mark on a predetermined position of the substrate, and the substrate then is covered with silicon dioxide. Photoresist then is applied over the substrate and selectively removed except over the mark. Etchant then is applied to remove all silicon dioxide except over the photoresist-covered mark. An epitaxial layer thereafter is grown over the substrate. The silicon dioxide over the mark prevents epitaxial growth in that region, so that the mark remains clear and optically visible for the rest of the IC processing.

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