Method of manufacturing a bus communication system for stacked h

Details Method of manufacturing a bus communication system for stacked h Method of manufacturing a bus communication system for stacked h

1995-05-22

1997-02-25

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

361790, 29830, H01R 2370

Patent

active

056055927

ABSTRACT:
The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

REFERENCES:
patent: 4961806 (1990-10-01), Gerrie et al.

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