Method of manufacturing printed circuit board by a build-up tech

Details Method of manufacturing printed circuit board by a build-up tech Method of manufacturing printed circuit board by a build-up tech

1994-12-27

1996-11-26

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, B05D 512

Patent

active

055783414

ABSTRACT:
A method of manufacturing a printed wiring board by a build-up technique improves the bonding force between a conductor circuit and a resin. After the surface of the first conductor pattern is roughened by oxidation, an insulating layer is formed to expose a viahole portion of the first conductor pattern. Then the resin insulating layer is roughened and the board is reduction processed before a plating operation is carried out.

REFERENCES:
patent: 4512818 (1985-04-01), Valayil et al.
patent: 5076864 (1991-12-01), Tanaka et al.
patent: 5106454 (1992-04-01), Allardyce et al.
patent: 5252355 (1993-10-01), Ando et al.
patent: 5382333 (1995-01-01), Ando et al.

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