Fishing – trapping – and vermin destroying
Patent
1993-07-23
1995-11-07
Fourson, George
Fishing, trapping, and vermin destroying
437 29, 437 34, 437 46, H01L 2176
Patent
active
054647894
ABSTRACT:
An improved method of manufacturing a semiconductor device, especially suitable for a p-channel MOS transistor is disclosed. The method includes the steps of forming a gate oxide film over the surface of a semiconductor substrate in a region where a p-channel MOS transistor is to be formed, forming a polysilicon film over the gate oxide film, in order to construct a gate electrode, forming a film of an amorphous material over the polysilicon film and implanting ions of a p-type impurity, especially elemental boron atoms, into the polysilicon film, through the film of amorphous material.
REFERENCES:
patent: 3793090 (1974-02-01), Barile et al.
patent: 4584026 (1986-04-01), Wu et al.
patent: 4617066 (1986-10-01), Vasudev
patent: 4703552 (1987-11-01), Baldi et al.
patent: 4728391 (1988-03-01), Lesk
patent: 4745079 (1988-05-01), Pfiester
patent: 4782033 (1988-11-01), Giersch et al.
patent: 4833097 (1989-05-01), Butler et al.
patent: 4904611 (1990-02-01), Chiang et al.
patent: 5036019 (1991-07-01), Yamane et al.
Wolf, S., Silicon Processing for the VLSI era vol. 1: Process Technology, Lattice Press Calif., 1986, pp. 321-325.
Ghandi, S., VLSI Fabrication Principles Silicon and Gallium Arsenide, .COPYRGT.1983, pp. 353-354.
U. Schwalke et al., Journal of Vacuum Science and Technology, vol. 7, No. 1, Jan./Feb. 1989, pp. 120-126.
J. Y.-C. Sun et al., IEEE, 1986, CH2381-2/86/0000-0236, IEDM 86, pp. 236-239, 1986.
Chow, T., P., "Plasma Etching of Refractory Gates For USSI Applications", Journal of the Electrochemical Society, Oct. 1984 pp. 2325-2335.
Fourson George
Kabushiki Kaisha Toshiba
LandOfFree
Method of manufacturing a CMOS semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a CMOS semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a CMOS semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-197035