Electronic package having buried passive components

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

3613215, 3613213, 3613061, 156 89, H01G 406

Patent

active

057576114

ABSTRACT:
The invention provides for an electronic package having a buried passive component such as a capacitor therein, and a method for fabricating the same. The electronic package preferably includes a passive component portion which includes a plurality of layers of high K dielectric material, a signal processing portion which includes a plurality of layers of low K dielectric material, and at least one buffer layer interposed between the passive component portion and the signal processing portion. Metallization is preferably printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material. Preferably, the layers are co-fired at a temperature below approximately 1200.degree. C. to form the electronic package and each of the buffer layers contains approximately 25 to 100% barium compound. Via conductors may also be provided through the buffer layers to electrically couple the passive component portion and the signal processing portion and the metallization and the via conductors may be selected from highly conductive materials such as gold, silver, copper and alloys thereof.

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"Stabilization of the Perovskite Phase and Dielectric Properties in the Pb(Mg.sub.1/3 Nb.sub.2/3 O.sub.3 -BaTio.sub.3 System" by Dong Heon Kang and Ki Hyun Yoon, 1991 Chapman and Hall.
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