Thermoplastic resin composition and heat-resistant tray for IC

Details Thermoplastic resin composition and heat-resistant tray for IC Thermoplastic resin composition and heat-resistant tray for IC

1999-05-11

2000-10-03

Boykin, Terressa M.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

528196, 528198, 528271, 528272, C08F28302

Patent

active

061274925

ABSTRACT:
A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The thermoplastic resin composition is excellent in heat-resistance and mechanical strength, and heat-resistant IC trays therefrom are useful products which can endure drying of IC at high temperature and are excellent in handling properties.

REFERENCES:
patent: 3365517 (1968-01-01), Barth

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