Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-12-03
2000-10-24
Potter, Roy
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257668, 257678, 257784, H01L 2348
Patent
active
061371661
ABSTRACT:
A semiconductor device including electrode pads on a semiconductor element, leads coupled with some of the electrode pads via bonding wires, and common lines provided on the semiconductor element that achieve electrical continuity for other electrode pads that handle a common signal. At least the surfaces of the common lines are covered with an insulating member such as an insulating adhesive tape. With this, the loops of the bonding wires can be lowered, thereby achieving a thinner package.
REFERENCES:
patent: 5252854 (1993-10-01), Arita et al.
patent: 5319241 (1994-06-01), Lim
OKI Electric Industry Co., Ltd.
Potter Roy
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