Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

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Details

257668, 257678, 257784, H01L 2348

Patent

active

061371661

ABSTRACT:
A semiconductor device including electrode pads on a semiconductor element, leads coupled with some of the electrode pads via bonding wires, and common lines provided on the semiconductor element that achieve electrical continuity for other electrode pads that handle a common signal. At least the surfaces of the common lines are covered with an insulating member such as an insulating adhesive tape. With this, the loops of the bonding wires can be lowered, thereby achieving a thinner package.

REFERENCES:
patent: 5252854 (1993-10-01), Arita et al.
patent: 5319241 (1994-06-01), Lim

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