Method and apparatus for detecting an IC defect using charged pa

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324 96, G01R 3128

Patent

active

057571988

ABSTRACT:
Test patterns are applied to an IC under test under a test pattern address by which the first fail is caused and under other test pattern addresses. A defect candidate area is moved to the position where a charged particle beam can scan the area and defect candidate wiring portions are specified. A potential data of the specified wiring is acquired for each of the test patterns and stored in a memory. This process is performed by sequentially stepping back the stop test pattern addresses. Then, a potential data of the specified wiring in the specified area is similarly acquired for non-defect IC. The respective potential data of the IC under test and the non-defect IC are compared to locate the mismatch test pattern address and wiring.

REFERENCES:
patent: 4358732 (1982-11-01), Johnston et al.
patent: 4870344 (1989-09-01), Stille
patent: 5164666 (1992-11-01), Wolfgang et al.
patent: 5391985 (1995-02-01), Henley
patent: 5528156 (1996-06-01), Ueda et al.

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