Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1991-04-29
1992-09-29
Pirlot, David L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439638, H05K 100
Patent
active
051510391
ABSTRACT:
An adapter to connect device leads to contacts arranged in a rectangle on a circuit surface. The adapter has a body and leads that extend outwardly, downwardly and then outwardly again in a pair of opposing curves to form feet which match the pattern on the circuit surface. The body has sites for connecting with the device and supports conductive elements connecting the leads to the sites. The adapter may connect gullwing-shaped device leads disposed in a rectangle (e.g., QFP) to contacts in a similar pattern. A substrate, such as a printed circuit board, may support the conductive elements. The conductive elements and adapter leads may be portions of a lead frame with portions of the body molded around them. A connector may provide connections between attachment sites and device leads. This connector may be a separate body, may include socket terminals, and may mate with another connector which has conductive elements for making connections between it and attachment sites on a second body, which may be contact pads for making solder connections to the leads of the device. Strain relief elements are shown. The body may include a stack of connected body portions. The device leads may be anchored in holes in the substrate, and may be bent portions of a lead frame sealed in a molded insulating body.
REFERENCES:
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patent: 4560218 (1985-12-01), Billman et al.
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patent: 4766478 (1988-08-01), Dennis
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"Advanced Interconnections Catalog #8, Quad. Flat Pack Adaptors" pp. 67-69, 1988.
Advanced Interconnections drawing, 2420-A.
Advanced Interconnections, Letter from Jack Reilly and drawings SK-2265, SK-2264, SK-2263, SK-2262.
Advanced Interconnections, drawings SK-2309 Rev O, SK-2309 Rev 1, and SK-2309 Sheet 20F2.
Letter by Jay Hartvigsen from Motorola to Advanced Interconnections.
Advanced Interconnections, drawings SK-2265, SK-2376, 3049-2A, 3049-2B, 3049-2, FAB3049-2B, 3049, 3093,3049, 3078REF, 3078-A, FAB3078(1 and 2), 3078, 3079, and Motorola, drawing entitled "132 PIN PQFP Adapter PWB".
Quote from Advanced Interconnections to Motorola, Inc.
Letter from Analog Devices; Advanced Interconnections catalog #9, pp. 73 and 77.
Die-Tech, drawings CZ-5700-PKG. Cross Section, CZ-5700-PKG. 150, CZ-5701-PKG. Assy.-DP., and "Die-Tech's Advanced Technologies-One Source for Solutions", promotional item.
Raychem, advertisement for SolderQuick Tape (seven pages).
Advanced Interconnections Corporation
Pirlot David L.
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