Sheet-framed IC carrier, method for producing the same, and IC c

Details Sheet-framed IC carrier, method for producing the same, and IC c Sheet-framed IC carrier, method for producing the same, and IC c

1996-08-19

1998-05-26

Haiec, Donald T.

Registers

Records

Conductive

235487, G06K 1906

Patent

active

057571163

ABSTRACT:
A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

REFERENCES:
patent: 4417413 (1983-11-01), Hoppe et al.
patent: 4443027 (1984-04-01), McNeely et al.
patent: 4639585 (1987-01-01), Hagiri et al.
patent: 5184209 (1993-02-01), Kodai et al.
patent: 5362955 (1994-11-01), Haghiri-Tehrani
patent: 5410136 (1995-04-01), McIntire et al.
patent: 5514862 (1996-05-01), Salzano

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