Method of encapsulating a crystal oscillator

Details Method of encapsulating a crystal oscillator Method of encapsulating a crystal oscillator

1995-03-31

1996-11-26

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29855, 29530, 257687, 26427217, 264255, H01R 4300, H01L 2324

Patent

active

055773192

ABSTRACT:
A method of encapsulating a crystal oscillator (100). First, a dielectric material is assembled or connected to the bottom side of a lead frame (102). Second, oscillator components including a piezoelectric element, capacitors and an integrated circuit are attached on the lead frame (104). Third, an epoxy dam is dispensed around the periphery of the oscillator component locations (106). Fourth, a encapsulant is dispensed within the epoxy dam to encapsulate the oscillator components (108). Fifth, the epoxy dam and encapsulant are cured (110). Thereafter, the oscillator is singulated from the lead frame and the leads are formed for mounting (112).

REFERENCES:
patent: 5041395 (1991-08-01), Steffen
patent: 5173766 (1992-12-01), Long et al.
patent: 5332864 (1994-07-01), Liang et al.

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